SUSS MicroTec Mask Aligner MA/BA6 Gen4
The mask aligner enables photolithography with feature sizes down to
0.6 μm. It is equipped with a 350 W mercury lamp in combination
with a Micro Optics Exposure Optic® facilitating a very
homogeneous exposure intensity over a 6" diameter exposure
area. Photomasks from 2" to 6" can be used. The mask
aligner supports different exposure modes (vacuum contact, hard
contact, and soft contact). The alignment of several device layers
can be carried out either manually or software-assisted and its
accuracy is about 0.25 - 0.5 μm. For steep resist edges a
removable i-line band pass filter is installed in the light
path. Contact Kseniia Pavlova for
introduction and training.