Cleanroom
Overview
The IMSEAM CoreFacility (ICF) cleanroom is a 227 m² facility for device fabrication and patterning. It includes an ISO class 8 room, two ISO class 7 labs and one large ISO class 5 section for photo- and electron-beam lithography.
Cleanroom Devices
Tabelle
Electron-Beam writer Raith eLINE Plus | |
Electron-Beam evaporator HVB-130 | |
Glovebox System with Spincoaters and thermal Evaporators | |
Photonic Professional GT2 Nanoscribe (not part of the ICF, in case of interest contact Mehran Mehrabanian) | |
Low-Pressure Plasma system (Zepto W6) | |
Sputtering System | |
SUSS Microtec Mask Aligner MA/BA6 Gen4 | |
Work Benches, Chemical Hoods and Flow Boxes |
Electron-Beam writer Raith eLINE Plus
The Raith eLINE Plus is a modularly expandable tool for advanced electron-beam lithography. It enables tailored fabrication of nano- and microstructures as well as ultra-high resolution imaging. Stitch-free fabrication of structures with dimensions of few tens of nanometers in arrays of up to 90 millimeters is possible with high reproducibility.
Our experimental achieved minimum feature size on SiOx for a thin liftoff metallization process is around 5 nm. Unique features of the system are: up to 27 mm variation along the z-coordinate; a 4 inch laser interferometer stage for movement and pattern placement in the nm range; a thermal field emission filament for ultrahigh resolution in all operation modes; tunable electron energy for damage-free imaging; and range of detectors, e.g. Everhart Thornley SE detector, InLens SE detector and angle selective BSE detector.
Electron-Beam evaporator HVB-130
The electron-beam evaporator HVB-130 (Winter Vakuumtechnik GbR) is equipped with an 8 slot crucible turret that enables subsequent evaporation of metals and certain oxides without source exchange or venting. The distance between evaporation source and the rotating sample stage is large enough to ensure a collimated and homogeneous material deposition (e.g. for lift-off structures). The evaporator is owned and operated by the Zaumseil group.
Note: This device is not part of the ICF and is not available in general. However, contact the responsible person in case of interest.
Glovebox System with Spincoaters and thermal Evaporators
Two modular glovebox systems (GS Glovebox Systemtechnik) are available.
One glovebox system allows for solution-processing of organic materials. It contains 2 spin-coaters, several hotplates with magnetic stirrers and a microbalance with an ionizer.
The other glovebox system consists of three connected gloveboxes and two thermal evaporators (Mantis Deposition Ltd.) integrated in the cleanroom wall.
The evaporator for the depostion of organic materials features 6 sources and enables co-deposition on rotating substrates at a controlled elevated temperature. The evaporator for the deposition of metals and other contact materials (Al, Ca, MoO3, Au, Ag, Cr, LiF, etc.) also features 6 sources. Up to 6-inch wafers can be coated. Both evaporators are accessible from the service corridor and can be operated and loaded from either side.
Photonic Professional GT2 Nanoscribe
The Photonic Professional GT2 Nanoscribe is equipped with a Carl Zeiss Optical Microscope (Objectives with optical magnifications: ×10, ×20, ×25 and ×63) and a laser system (class 3B, wavelength 780 nm, pulse duration 80-120 fs, repetition rate: 80 MHz). This device is intended to be used as 3D printer for the fabrication of polymeric nano/microstructures (nanoscale printing: down to 160nm spatially, microscale printing: 50-700µm typically, mesoscale printing: in mm dimensionally). The technology is based on a lithographic additive or subtractive process with resins or resists as basic material on a substrate. The Photonic Professional GT2 Nanoscribe is owned and operated by the Selhuber group.
Note: This device is not part of the ICF and is not available in general. However, contact the responsible person in case of interest.
Low-Pressure Plasma system (Zepto W6)
Low-pressure plasma (Zepto W6) is equipped with a PC, a 40 kHz generator, and used mostly for bonding materials or modify the surface properties in a targeted manner. Further applications include the fine cleaning of contaminated components, the plasma activation of plastic parts, the etching of PTFE, and more. Currently the plasma setup is limited for oxygen only, however by varying the process parameters such as pressure, power (0-100 W), process time, gas flow and composition can achieve multi plasma effects.
Sputtering System
The UHV magnetron sputter system (PREVAC) supports the deposition (RF and DC magnetron sputtering in sputter-down geometry) of dielectric and metallic layers on up to 4 inch substrates under HV/UHV-conditions, reactive sputtering of metal oxides and metal nitrides, co-deposition of metals and metal oxides as well as substrate cleaning with an ion gun. Substrates can be cooled or heated (up to 650 °C) during deposition.
SUSS Microtec Mask Aligner MA/BA6 Gen4
The mask aligner enables photolithography with feature sizes down to 0.6 μm. It is equipped with a 350 W mercury lamp in combination with a Micro Optics Exposure Optic® facilitating a very homogeneous exposure intensity over a 6" diameter exposure area. Photomasks from 2" to 6" can be used. The mask aligner supports different exposure modes (vacuum contact, hard contact, and soft contact). The alignment of several device layers can be carried out either manually or software-assisted and its accuracy is about 0.25 - 0.5 μm. For steep resist edges a removable i-line band pass filter is installed in the light path.
Work Benches, Chemical Hoods and Flow Boxes
The yellow room “Photolithography” features wet benches equipped with an ultrasonic bath for substrate cleaning, spin-coaters, hotplates, a dry oven and a fume hood for coating samples with photoresist and subsequent developing of exposed samples. The room “Device fabrication” contains a wet bench, flow- and gloveboxes.
